Basic Mechanisms and Models of Multi‐Wire Sawing

By H. Möller. 2004

239 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/82a55dfac45988335c20c36ad21e049b730c2788

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Z. Pei
2. Ran Jin

Citations in the corpus

• Grinding of silicon wafers: A review from historical perspectives (2008, background): “More information about wire sawing can be found in the literature [76-79].”
• PDE-Constrained Gaussian Process Model on Material Removal Rate of Wire Saw Slicing Process (2011, background): “2 1 Introduction The wire saw slicing technology has been widely used in wafer manufacturing due to its numerous advantages: it offers high throughput capacities, decreased surface damage, and lower Kerf loss [1-4].”