Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

By M. Kerr, Nikhilesh Chawla. 2004

209 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/8169044abfbb1a703cefe506b763fa8ced372521