A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials

By M. Arif, Xinquan Zhang, Mustafizur Rahman, Senthil Kumar. 2013

233 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/80756303419ae56347107d009773e78fd11c0c08

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Gerry Byrne
2. Fengzhou Fang
3. Wei Gao
4. Hans Nørgaard Hansen
5. Yuebin B. Guo
6. Tugrul Özel
7. Yigit Karpat

In Electrical and Electronic Engineering

1. Gerry Byrne
2. Hans Nørgaard Hansen
3. Yuebin B. Guo
4. Fengzhou Fang
5. Tugrul Özel

In Mechanical Engineering

1. Gerry Byrne
2. Yuebin B. Guo
3. Hans Nørgaard Hansen
4. Tugrul Özel
5. Yigit Karpat

Citations in the corpus

• Diamond machining of silicon: A review of advances in molecular dynamics simulation (2015, unknown): “54 was actually understood from the nanoindentation experiments which suggests that brittleness is an indentation size effect [34].”
• Nanomanufacturing—Perspective and applications (2017, background): “Moreover, the ductile–brittle transition (DBT) phenomenon can be treated as the intersection point of the specific cutting energy curves representing the ductile and brittle behavior, respectively [9].”