Colloidal Processing of Ceramics
By J. Lewis. 2004
1,293 citations recorded by the source corpus.
Subfields: Ceramics and Composites, Electrical and Electronic Engineering, Water Science and Technology
View Paper: https://www.semanticscholar.org/paper/7fd5c3a5130dd63cb7fb52d41947d242da3ae13a
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The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Ceramics and Composites
In Electrical and Electronic Engineering
- J. Rödel
- Ke Wang
- Christopher B. Williams
- David W. Rosen
- Michael J. Solomon
- J. Vermant
- J. Cochran
- Jingfeng Li
In Water Science and Technology
Citations in the corpus
- Requirements for the transfer of lead-free piezoceramics into application (2018, background): “Approaches to tackle these issues include adjustment of the pH value [53], use of spray- or freezedrying [52], or addition of surfactants [54,55].”
- Additive manufacturing of metallic cellular materials via three-dimensional printing (2011, background): “& Green part density: By working with the powder in its raw, loose form, 3DP avoids the solids loading and rheology constraints found in the other ceramic AM technologies that work with powder/binder suspensions (e.g., aqueous [36] and hot-melt [37] direct inkjet printing, extrusion [ 38 ], and ster”