The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, and Reliability

By Richard K. Williams, M. Darwish, R. Blanchard, R. Siemieniec, P. Rutter, Y. Kawaguchi. IEEE Transactions on Electron Devices, 2017

134 citations recorded by the source corpus.

Subfields: Automotive Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/7e8682be776dd0fb838f15fa475ccdad83517b26