Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

By Y. Kagawa, N. Fujii, K. Aoyagi, Y. Kobayashi, S. Nishi, N. Todaka, S. Takeshita, J. Taura, H. Takahashi, Y. Nishimura and 8 more. International Electron Devices Meeting, 2016

175 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/7aca3c8d75c522038b21d0f4f22abb3f18a3b63f