Relationship between interfacial adhesion and electromigration in Cu metallization

By Michael Lane, Eric G. Liniger, James R. Lloyd. IEEE International Integrated Reliability Workshop Final Report, 2002

285 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/7a0e560b07723907ff0de8343fabb0da74db2c84