Room temperature Cu–Cu direct bonding using surface activated bonding method

By T. H. Kim, M. Howlader, T. Itoh, T. Suga. 2003

317 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/78ead9783d4f93a9663aa19fec3499d76ef2fe43