Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints

By G. Ghosh. 2001

153 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/77906615dcfcc22aee9e2d72b59758c749f526c0