Review of metallic phase change materials for high heat flux transient thermal management applications

By P. Shamberger, N. Bruno. 2020

213 citations recorded by the source corpus.

Abstract Metallic phase change materials offer an approach to rapidly transport heat away from a critical device, and to store that heat using the latent heat of fusion, buffering the temperature of a device during periods of transient high-power operation. Despite this interest, thermophysical properties and details of melting behavior of metallic alloys and compounds are scattered across the literature. Here, we critically review metallic phase change materials, and introduce quantitative comparative metrics to evaluate the relative performance of different compounds. This review focuses on (1) discussion of advanced prototype systems based on metallic phase change materials which rapidly absorb heat and buffer temperature rise in different devices and components, (2) historical development and focused applications of these materials by different communities, (3) identification of chemical alloy families with desirable melting characteristics, (4) critically evaluated thermophysical properties of different chemical alloy families, and (5) description of characteristic melting behavior in metallic systems. We focus here on describing different chemical classes of metallic phase change materials with melting points, Tfus, from near room temperature to

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/7662cbc9d4f65092e0973e7363b8e1386e3acb20

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In Materials Chemistry

1. J. Mathew
2. Shankar Krishnan
3. Marko J. Tadjer

In Mechanical Engineering

1. J. Mathew
2. Shankar Krishnan

Citations in the corpus

• A Review On Transient Thermal Management of Electronic Devices (2021, methodology): “This is discussed in detail by Shamberger and Bruno [94].”
• Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective (2023, background): “ing on transient thermal management have recently been published [81, 184, 185].”