Broadband Microwave Frequency Characterization of 3-D Printed Materials

By P. Deffenbaugh, Raymond C. Rumpf, K. Church. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2013

157 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/7645c222528c25176a270d87278c2881e0b2467a

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In Electrical and Electronic Engineering

1. Ryan B. Wicker

Citations in the corpus

• Multiprocess 3D printing for increasing component functionality (2016, background): “, FR4 laminates), with reasonable permittivity, loss tangent (43), and dielectric strength (44).”