Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

By Y. Li, C. Wong. 2006

697 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/74f59ddec4a155104f9893c60f2b5cf7535dab4b

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Huan Li
2. J. Eksteen
3. E. Oraby

Citations in the corpus

• Hydrometallurgical recovery of metals from waste printed circuit boards (WPCBs): Current status and perspectives – A review (2018, background): “Another kind of joining material is electrically conductive adhesives (ECAs), consisting of polymeric binder and metal fillers (Ag, Au, Cu, or Ni), which is considered to be more environmentally friendly than Pb solder (Li and Wong, 2006).”