Three-dimensional numerical simulation of heat and fluid flow in noncircular microchannel heat sinks
By Yongping Chen, Chengbin Zhang, M. Shi, Jiafeng Wu. 2009
163 citations recorded by the source corpus.
Subfields: Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/749d152f7d28517ad11f7b74ed6bf40fca81d3c1
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In Mechanical Engineering
Citations in the corpus
- A comprehensive review on microchannel heat sinks for electronics cooling (2023, background): “Chen et al [31] believed that the triangular microchannel performed the best in heat transfer, followed by the trapezoidal microchannel, and the rectangular microchannel is the worst.”