Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

By A. Volinsky, Joseph B Vella, William W. Gerbericha. 2003

266 citations recorded by the source corpus.

Subfields: Ceramics and Composites, Electronic, Optical and Magnetic Materials, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/7121fed4711548d03e95657d32511b43c8b0e616