An improved anodic bonding process using pulsed voltage technique

By T. Lee, I. Hsing, C.Y.N. Liaw. Journal of microelectromechanical systems, 2000

141 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/7012489dd39d3e19a7466918538bb45210ffb83e

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In Electrical and Electronic Engineering

  1. A. A. Darhuber
  2. S. Troian

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