Self-forming diffusion barrier layer in Cu–Mn alloy metallization

By J. Koike, M. Wada. 2005

245 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/6ca53be4d84bb1a4c09ca661c6bb0adadad4e98d