Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

By D. Ma, W. D. Wang, Susanta Lahiri. 2002

146 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/6a0bc055b62f456954694f3425f30d7b65ad4ad7