Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

By Xin Deng, G. Piotrowski, Jason J. Williams, Nikhilesh Chawla. 2003

161 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/675e6112486375f025eba4cf643adaae0273b441