Three‐dimensional boundary integral modeling of spontaneous earthquake sequences and aseismic slip
By N. Lapusta, Yi Liu. 2009
245 citations recorded by the source corpus.
Subfields: Geophysics
View Paper: https://www.semanticscholar.org/paper/661e9e4150eebbdbd20adbd4fbad42d5e7e0197a
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In Geophysics
- Jean-Philippe Avouac
- G. Mclaskey
- Y. Kaneko
- H. Noda
- Brian D. Kilgore
- N. Lapusta
- Jean-François Molinari
- N. Kato
Citations in the corpus
- Foreshocks during the nucleation of stick‐slip instability (2013, background): “But an increasing number of studies show a complicated interplay between slow and presumably aseismic slip and more rapid, potentially seismic slip [Lapusta and Liu, 2009; Lengline et al., 2012; Ghosh et al., 2012].”
- Three‐dimensional earthquake sequence simulations with evolving temperature and pore pressure due to shear heating: Effect of heterogeneous hydraulic diffusivity (2010, methodology): “[87] Previous studies [Lapusta et al., 2000; Lapusta and Liu, 2009] stored the values ( _D**(tn) + _D*(tn+1))/2 as the history for tn < t < tn+1, for use in computing dynamic stress transfers.”
- Statistical physics of fracture, friction, and earthquakes (2011, background): “Numerical simulations of complex earthquake sequences due to interactions between some asperities have been carried out by Kato and Hirasawa (1999b), Kato (2004), Lapusta and Liu (2009), and Kaneko et al. (2010).”
- Towards inferring earthquake patterns from geodetic observations of interseismic coupling (2010, methodology): “S2 Description of the fault models and parameters We use fault models (Lapusta et al., 2000; Lapusta and Liu, 2009) in which earthquakes are simulated as a part of spontaneously occurring earthquake sequences on a fault that is subjected to slow, tectonic-like loading.”
- Dynamic crack propagation with a variational phase-field model: limiting speed, crack branching and velocity-toughening mechanisms (2017, background): “scales, ranging from kilometres for earthquakes [20,35], to millimetres for composite plates [71] or heterogeneous thin films [64] or even to nanometres in metallic glasses [48].”