Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

By H. Kim, Yj Lee, K. Paik, K. Koh, J. Woon, S. Choi, Jy Lee, J. Moon, Yun-Mook Park. Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001

228 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/640dfb880a12fb4c19baac4668689319da76e6ca