Cold sintering process: A new era for ceramic packaging and microwave device development

By Jing Guo, Amanda Baker, Hanzheng Guo, M. Lanagan, Clive A. Randall. 2017

177 citations recorded by the source corpus.

Subfields: Ceramics and Composites, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/632f4614a49269ae3b9fd7e6f758bd046c0c6b81

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Ceramics and Composites

1. Michael J. Reece
2. Salvatore Grasso
3. M. Biesuz

In Electrical and Electronic Engineering

1. Jing Guo
2. S. L. Lenny Koh
3. T. Ibn‐Mohammed
4. K. Mustapha
5. Michael J. Reece
6. Derek C. Sinclair
7. I. Reaney
8. Salvatore Grasso

In Materials Chemistry

1. Dawei Wang
2. I. Reaney
3. Jing Guo
4. Michael J. Reece
5. Clive A. Randall
6. Derek C. Sinclair
7. Salvatore Grasso
8. M. Biesuz

Citations in the corpus

• A review of cold sintering processes (2020, background): “1; Qf, 1700– 30500 GHz) were obtained by CSP processing (T < 200 °C, 30–350 MPa) [66].”
• Decarbonising ceramic manufacturing: A techno-economic analysis of energy efficient sintering technologies in the functional materials sector (2019, background): “A clear distinction between the two techniques lies in the fact that within a LPS, a molten phase with high temperature enhances the diffusion processes but within CSP, such phases are replaced by a solvent and high pressures [133].”