Transient liquid phase bonding

By William F. Gale, D. Butts. 2004

268 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/618ab880e715b4807d406cb01f7aac40fcd71d37

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In Electrical and Electronic Engineering

1. V. Singh

Citations in the corpus

• Recent research progress in solid state friction-stir welding of aluminium–magnesium alloys: a critical review (2020, background): “While, in other fabrication process like transient liquid phase (TLP) bonding, the IMCs formation took place in a short time to complete the process [87,119,88].”