Thermoelectric cooler application in electronic cooling
By R. Chein, Guanming Huang. 2004
333 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/5ef6b1c3f46d6766dd00b6c6ea13493a1ac753c1
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The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Materials Chemistry
In Mechanical Engineering
- Qun Chen
- Zengyuan Guo
- Moran Wang
- Hosung Lee
- Kourosh Kalantar-Zadeh
- Dongliang Zhao
- Yuying Yan
- Mohd Faizul Mohd Sabri
Citations in the corpus
- Optimization principles for convective heat transfer (2009, background): “In addition, since the birth of electronic technology, electricity-generated heat in electronic devices has frequently posed as a serious problem [8,9], and effective cooling techniques are hence needed for reliable electronic device operation and an increased device lifespan.”
- A comprehensive review of thermoelectric technology: materials, applications, modelling and performance improvement (2016, background): “The purpose of a TEC is to maintain the junction temperature of an electronic device below a certain temperature by removing heat from the device [69].”
- Optimal design of thermoelectric devices with dimensional analysis (2013, background): “Introduction Thermoelectric devices (thermoelectric generator and cooler) have found comprehensive applications in solar energy conversion [1], exhaust energy conversion [2,3], low grade waste heat recovery [4,5,6], power plants [7], electronic cooling [8], vehicle air conditioners, and refrigerator”
- Transition metal oxides – Thermoelectric properties (2013, background): “microprocessors, charge coupled devices (CCD), IR cooling in optoelectronic systems, air conditioners and laboratory cooling plates[67, 342, 343].”
- A review on thermoelectric renewable energy: Principle parameters that affect their performance (2014, background): “The general design criteria for these TECs include high reliability, flexibility in packaging and integration and low weight [152,153].”
- A review of thermoelectric cooling: Materials, modeling and applications (2014, background): “In most cases, the maximum electronic device junction temperature needs to be held less than 85 C for reliable operation [42,77].”