Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure

By Yong Wei, S. Chen, Y. Lin, Zimei Yang, Lan Liu. 2015

140 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/5ae6d06bc29ffc723d320d23ca62fee23b0a2603