Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface

By K. Yamamura, T. Takiguchi, M. Ueda, H. Deng, A. Hattori, N. Zettsu. 2011

200 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/5a04d9813fa14d0ea07ac349acedd93adac01c0b

Citations in the corpus

• Damage evolution mechanism and low-damage grinding technology of silicon carbide ceramics (2024, unknown): “Beyond the aforementioned energy fields, plasma [207–209], ion beam [210–213], electron beam [214, 215] and particle beam [216] also demonstrate significant advantages in achieving low-or no-damage machining of hard and brittle materials.”