Thermal Interface Materials

By Matthew Hart. Journal of Electronic Materials, 2019

211 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/5838e84ac024a377a6d870d51441aff926a97163

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Materials Chemistry

1. W. Long
2. Johan Liu
3. Yongfei Li
4. J. Hansson
5. Yanxia Tang
6. Haiyan Yan

Citations in the corpus

• Novel nanostructured thermal interface materials: a review (2018, background): “reflow, a very low thermal interface resistance can be achieved [8].”
• Enhanced thermal conductivity in polymer composites with aligned graphene nanosheets (2014, background): “Gapfilling thermal interface materials (TIMs) [2], applied between heat sources and heat sinks, are essential ingredients of thermal management and play a key role in effectively dissipating the heat generated in microprocessors and electronics.”