Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

By M. Islam, Yan Cheong Chan, M. J. Rizvi, W. Jillek. 2005

151 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/57c75ae7e79a21bb43f894e91e1fa533e62fead1