Test Challenges for 3D Integrated Circuits

By H. Lee, Krishnendu Chakrabarty. IEEE Design & Test of Computers, 2009

338 citations recorded by the source corpus.

Subfields: Automotive Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/56df8526ba7dd450600d25dc6c4e434177ba7560

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. G. Jimenez
2. George S. Dulikravich
3. A. Abdoli

Citations in the corpus

• Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot (2015, background): “Three-dimensional (3-D) integrated circuits (ICs) are believed to be the best way to overcome barriers in inter-connect scaling and keep Moore's law ticking by providing an opportunity for continued higher performance ICs in the semiconductor industry [1].”