Surface wettability change during pool boiling of nanofluids and its effect on critical heat flux
By S. Kim, In Cheol Bang, J. Buongiorno, Lin-wen Hu. 2007
896 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/56bc82918e83d838a905903bd66dd67685108792
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
- Gangtao Liang
- I. Mudawar
- Ali J. Chamkha
- Kambiz Vafai
- Ioan Pop
- Khalil Khanafer
- Arun Sadashiv Mujumdar
- Xiangrong Wang
In Mechanical Engineering
- I. Mudawar
- Gangtao Liang
- Satish G. Kandlikar
- Suresh V. Garimella
- Ping Cheng
- Ali J. Chamkha
- Kambiz Vafai
- S. Gong
Citations in the corpus
- Study of pool boiling and critical beat flux enhancement in nanofluids (2007, methodology): “(5) Theofanous and Dinh [23] state that κ is a surfacedependent parameter that ‘for a well-wetting surface is smaller than for a poorly-wetting surface’, however they do not provide an analytical expression for it.”
- Heat transfer to a silicon carbide/water nanofluid (2009, background): “No particle coating was detected with the Al2O3/water nanofluid [9], but, in a related study [17], it was concluded to be the source of the heat transfer enhancement.”
- Review of pool boiling enhancement with additives and nanofluids (2018, methodology): “[100] recommended an alternative expression to predict CHF for nanofluids based on the hot/dry spot theory of Theofanous and Dinh [315],”
- Single bubble dynamics on a superhydrophilic surface with artificial nucleation sites (2011, background): “Significant enhancement in the critical heat flux of pool boiling in nanofluids has been also attributed to the improved wettability caused by nanoparticle deposition [4,5].”
- A review on nanofluids - part II: experiments and applications (2008, methodology): “Li et al. (2003) also observed deteriorated pool boiling heat transfer for CuO/water nanofluids.”