High temperature ultrasonic transducers: review
By R. Kazys, A. Voleisis, B. Voleišienė. Ultrasound, 2008
133 citations recorded by the source corpus.
The problems of development of high-temperature ultrasonic transducers for modern science and technology applications are analysed. More than 10 piezoelectric materials suitable for operation at high temperatures are overviewed. It is shown that bismuth titanate based piezoelectric elements are most promisable. Bonding methods of piezoelectric elements to a protector and backing are discussed. Thermosonic gold-to-gold bonding is most modern and possesses unique features. Our achievements in this field are analysed in the context of world progress. In sol-gel and chemical vapour deposition technology bonding and sometimes coupling problems are avoided at all. Design peculiarities of the transducers are reviewed. Commercial sensors in the meanwhile are often characterized with poor performance in extreme conditions. In conclusions recommendations for high temperature ultrasonic transducers design are formulated.
Subfields: General Materials Science, Industrial and Manufacturing Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/5456eca39a8e56a8dda40922561bf1fee8a3dfa1
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Mechanical Engineering
Citations in the corpus
- High-Temperature Piezoelectric Sensing (2013, background): “Nevertheless, the test results Sensors 2014, 14 155 suggest a great potential of AlN-based SAW devices for high-temperature applications at temperatures up to 1,000 °C. 3.3.3.”