Thermal and flow analysis of microchannel heat sink (MCHS) cooled by Cu–water nanofluid using porous media approach and least square method
By Mohammad Hatami, D. Domiri Ganji. 2014
244 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/5157fa819cefff77291ad27b5ba7f490c745194d
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In Biomedical Engineering
In Mechanical Engineering
Citations in the corpus
- A comprehensive review on microchannel heat sinks for electronics cooling (2023, methodology): “…fluid, and the nanofluid can be supposed as a novel single-phase liquid, of which all the properties such as density, heat capacity, thermal conductivity and viscosity should be reevaluated by new models, such as the 3D porous media approach and the 3D solid and fluid coupling approach [87–90].”
- Magnetic field effect on nanoparticles migration and heat transfer of water/alumina nanofluid in a channel (2014, unknown): “[23–25], Yang et al.”
- Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink (2015, background): “Fortunately, the microchannel heat sink (MCHS) proposed by Tuckerman and Pease [1] in 1981 can endure a heat flux as high as 790 W cm , which becomes a significant way for thermal management of microelectronic devices and attracts a great deal of attention [2–20].”