Structural Health Monitoring by Piezo–Impedance Transducers. II: Applications
By Suresh Bhalla, Chee Kiong Soh. 2004
140 citations recorded by the source corpus.
Subfields: Civil and Structural Engineering, Mechanical Engineering, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/50fdd3f91e2777cfaa01a5d85efe848607b064a8
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Civil and Structural Engineering
- Chee Kiong Soh
- Suresh Bhalla
- Charles R. Farrar
- Gyuhae Park
- Yee Yan Lim
- H. Lee
- Rudy Tawie
- F. Lanza di Scalea
In Mechanical Engineering
In Mechanics of Materials
- Chee Kiong Soh
- Suresh Bhalla
- Charles R. Farrar
- Gyuhae Park
- Yee Yan Lim
- H. Lee
- Rudy Tawie
- Venu Gopal Madhav Annamdas
Citations in the corpus
- Electromechanical Impedance Modeling for Adhesively Bonded Piezo-Transducers (2004, methodology): “Electro-mechanical admittance, which is the measured electrical parameter, can be decomposed and analyzed to extract the impedance parameters of the host structure (Bhalla and Soh, 2004b,c).”