Recent advances in flip-chip underfill: materials, process, and reliability

By Zhuqing Zhang, C. Wong. IEEE Transactions on Advanced Packaging, 2004

201 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/50e4daf433068ee996db88c2ec7fc7c4b3537cb3