Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

By S. Hou, W. C. Chen, C. Hu, C. Chiu, K. Ting, T. Lin, W. H. Wei, W. Chiou, Vic J. C. Lin, V. C. Chang and 3 more. IEEE Transactions on Electron Devices, 2017

167 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/4fdb3ad5a8e2feb2b46054a9ad20ac445eb4c72c