Study of surface integrity using the small area EDM process with a copper–tungsten electrode

By Hwa-Teng Lee, F. Hsu, T. Tai. 2004

160 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/4dc132a2fccefc59dde32a370735326944cb3c24

How researchers see this paper

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In Biomedical Engineering

1. M. Sadeghi

In Electrical and Electronic Engineering

1. M. Sadeghi

In Mechanical Engineering

1. M. Sadeghi

Citations in the corpus

• Residual stresses and white layer in electric discharge machining (EDM) (2007, background): “078 electrode polarity, material properties of the tool electrode, workpiece and dielectric liquid, debris concentration and even size of the electrode [2].”
• INVESTIGATING THE EFFECTS OF EDM PARAMETERS ON SURFACE INTEGRITY, MRR AND TWR IN MACHINING OF Ti–6Al–4V (2012, background): “The reason for surface cracks formation is that if the tensile stresses resulting from shrinkage of molten material during cooling the workpiece surface after spark, exceeding the material’s ultimate tensile stress within the white layer lead to creation of surface cracks (Lee et al., 2004).”