Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
By R. Rímolo-Donadío, X. Gu, Y. Kwark, M. Ritter, B. Archambeault, F. Paulis, Yaojiang Zhang, Jun Fan, H. Brüns, Christian Schuster. IEEE transactions on microwave theory and techniques, 2009
173 citations recorded by the source corpus.
View Paper: https://www.semanticscholar.org/paper/4c90274c871f5417428c6fc4303731916776ece1
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Citations in the corpus
- Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions (2010, background): “effects of via transitions on SI, as well as modeling approaches, have been extensively investigated analytically and numerically [30]–[36].”