Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

By Kazuhiro Nogita, C. Gourlay, T. Nishimura. 2009

154 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/49ef8677791ec635a671d9f5c495317ac4b3557d