Direct writing in three dimensions

By J. Lewis, G. M. Gratson. 2004

457 citations recorded by the source corpus.

Abstract The ability to pattern materials in three dimensions is critical for several emerging technologies, including photonics, microfluidics, microelectromechanical systems, and biomaterials. Direct-write assembly allows one to design and rapidly fabricate materials in complex three-dimensional shapes without the need for expensive tooling, dies, or lithographic masks. Here, recent advances in ink and laser writing techniques are reviewed with an emphasis on the push toward finer feature sizes. Opportunities and challenges associated with direct-write assembly are also highlighted.

Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering

View Paper: https://www.semanticscholar.org/paper/48e6c9a5141777add96b17a7ffdfb1784a14f2c6

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Atomic and Molecular Physics, and Optics

1. Gang Wu
2. Chi Zhou
3. Min Wei
4. Feng Zhang
5. Paschalis Alexandridis
6. J. Goole
7. K. Amighi
8. Wen Wang

In Biomedical Engineering

1. Paul K. Wright
2. D. Mattia
3. Gang Wu
4. Chi Zhou
5. Min Wei
6. Feng Zhang
7. Paschalis Alexandridis
8. J. Goole

Citations in the corpus

• A super ink jet printed zinc–silver 3D microbattery (2009, background): “have already demonstrated the ability to deposit multilayer structures and devices as well as 3D architectures [3].”
• 3D printing in pharmaceutics: A new tool for designing customized drug delivery systems. (2016, methodology): “Nozzle-based deposition systems allow direct writing, which relies on computer-controlled manufacturing methods that deposit ink direct through a nozzle to create a 3D pattern layer-bylayer with controlled composition and architecture [Lewis and Gratson, 2004].”