Influence of interfacial intermetallic compound on fracture behavior of solder joints

By Hwa-Teng Lee, Ming-Hung Chen, Huei-Mei Jao, Tain-Long Liao. 2003

242 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/4821cdf5a0930c2516115f7d99736e6f72c8e4b3

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. J. Willingham
2. Russell Goodall
3. Matthew Way

Citations in the corpus

• Brazing filler metals (2019, background): “residual stresses in the joint [129,130]; indeed, residual stresses sufficient to cause failure can even be formed in joints between the same material just due to the Coefficient of Thermal Expansion (CTE) mismatch with the filler where a thick (∼10 μm) layer of intermetallic is formed [131].”