Additive Behavior during Copper Electrodeposition in Solutions Containing Cl − , PEG, and SPS

By Mingsheng Tan, John N. Harb. 2003

157 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/4778cc08881cfb773a591d4ef6d46915221d69f2