Analytical and computational description of effect of grain size on yield stress of metals
By H. Fu, David J. Benson, M. Meyers. 2001
298 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/4733cd0b5c7f498eabfa5d685774cde8f226e1e8
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In Electrical and Electronic Engineering
In Materials Chemistry
- David L. McDowell
- John D. Clayton
- S. Walley
- Sneha N. Naik
- D. Bammann
- Dierk Raabe
- Franz Roters
- Philip Eisenlohr
Citations in the corpus
- Atomistic based continuum investigation of plastic deformation in nanocrystalline copper (2006, unknown): “In finite element simulations conducted by Fu et al. (2001, 2004) and Schwaiger et al. (2003), the microstructure was modeled as two distinct phases, a grain boundary affected zone (GBAZ), and a grain interior.”
- Modeling Dislocations and Disclinations With Finite Micropolar Elastoplasticity (2006, background): “Meyers and co-workers (Meyers and Ashworth, 1982; Benson et al., 2001; Fu et al., 2001) invoked composite models featuring grain boundary layers of relatively high dislocation density to explain grain size influences on yielding.”