Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
By Xiaojin Wei, Yogendra K. Joshi. Heat Transfer, 2000
159 citations recorded by the source corpus.
A novel heat sink based on a multi-layer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6 m3/s (50 ml/min) to 6.67×10−6 m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/466e108c425621a8e73c317868f774dcad9850f4
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Mechanical Engineering
Citations in the corpus
- Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink (2015, background): “Following Vafai and Zhu’s work, extensive studies focused on the DL-MCHS were conducted [22–37], which further justified the results indicated by Vafai and Zhu [22–24], demonstrated that the channel number [25,26], aspect ratios of the top and bottom channels [25–29], channel-to-pitch width ratio [2”