Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

By S. Terashima, Y. Kariya, T. Hosoi, Masamoto Tanaka. 2003

193 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/45ee7dc6afe39ccf3c38e6f9018fb71573b210ae