Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

By Jin Yu, J. Y. Kim. 2008

169 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/45c67d3f14eb84cef8f2d330769bb545b57ca56f