Mechanisms for room temperature direct wafer bonding

By T. Plach, K. Hingerl, S. Tollabimazraehno, G. Hesser, V. Dragoi, M. Wimplinger. 2013

175 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/448d56449478152b351884cf60f22ca6af67bb38