Grinding force and power modeling based on chip thickness analysis

By R. Hecker, S. Liang, Xiao Wu, Pin Xia, David Jin. 2007

222 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Civil and Structural Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/432f74f0bc9e94fc0fc186bc53785bb4df2cb15e