Materials chemistry for low-k materials

By B. Hatton, K. Landskron, W. Hunks, M.R. Bennett, Donna Shukaris, D. Perovic, G. Ozin. 2006

245 citations recorded by the source corpus.

The microelectronics industry is constantly trying to reinvent itself, to find new technological solutions to keep pace with the trend of increasing device densities in ultra-large-scale integrated (ULSI) circuits. Integral in this development has been the replacement of the conventional Al/SiO2 metal and dielectric materials in multilevel interconnect structures. Higher-conductivity Cu has now successfully replaced Al interconnects, but there is still a need for new low dielectric constant (k) materials, as an interlayer dielectric.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/42842a0ae7388e6c3fe87cb63abd1bfe39e5b1fc