On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites
By L. Weber, R. Tavangar. 2007
286 citations recorded by the source corpus.
Subfields: Ceramics and Composites, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/3e21d1b2d3a50f4570ef1b832bd30e49310b4a08
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In Ceramics and Composites
In Mechanical Engineering
Citations in the corpus
- Thermal Conductivity of Diamond Composites (2009, unknown): “The thermal conductivity of composites was reported to reach 700 W/(m⋅K) in [12,15,99], and 640 W/(m⋅K), by Schubert et al.”
- Thermal Boundary Conductance: A Materials Science Perspective (2016, background): “Indeed, as illustrated schematically in Figure 1a, the detailed structure of the interface can dramatically impact TBC, be it through an interfacial layer [whether interdiffused (16, 40, 133, 139) or deliberately added (10, 140--142)], its roughness (41, 143), or simply the substrate’s chemical term”
- Review of metal matrix composites with high thermal conductivity for thermal management applications (2011, background): “5% (molar fraction), the TC increases and the CTE decreases due to the transition from weak bonding to strong bonding by the formation of carbides [21].”