Electroless deposition of Ni–Cu–P, Ni–W–P and Ni–W–Cu–P alloys

By J. Balaraju, K. Rajam. 2005

215 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/3d725caec197e6aca21bfd3fe32ca870f1bd9823

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In Atomic and Molecular Physics, and Optics

1. J. Sudagar

In Electrical and Electronic Engineering

1. J. Sudagar

Citations in the corpus

• Electroless nickel, alloy, composite and nano coatings – A critical review (2013, background): “Addition of copper or tin in Ni-WP baths has resulted in quaternary deposits Ni-W-Cu-P and Ni-W-Sn-P with increased crystallinity ([73-75]).”