Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

By Keun-Soo Kim, S. Huh, Katsuaki Suganuma. 2003

617 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/3bacbbb043c34d82b696990a5b5555f0542c4cbf